TSMC (Taiwan Semiconductor Manufacturing Company) expects to restart full operation at its Fab 6 and Fab 14 manufacturing sites, which were struck by an earthquake of 6.4 magnitude in southern Taiwan on February 6, reported the Economic Daily News on February 13. The company estimated that the earthquake will affect first-quarter 2016 wafer shipments by more than 1%—slightly higher than its previous assessment. Fab 6, which mainly produces 8-inch wafers used in wearable and IoT (Internet of Things) devices, has resumed normal operation. Fab 14B, which makes 12-inch wafers using 16-nm and 20-nm process technologies, also has been fully restored to normal. Fab 14A, which was more severely damaged in the temblor, is anticipated to recover today to continue manufacturing 12-inch wafers for MCUs (Micro Control Units) and PCs.